With its expertise in the development and production of thick film substrates and customized semiconductor micro-module packaging, TONG HSING is dedicated to research and development, process optimization and the provision of customer satisfaction.

同欣電子的封裝服務與基板製造技術，現已廣泛應用於：無線通訊、MEMS、 影像感知器、光電半導體元件、LED、太陽能電池、汽車電子、電腦周邊零組件、醫療與網路設備等領域

With its expertise in the development and production of thick film substrates and customized semiconductor micro-module packaging, TONG HSING is dedicated to research and development, process optimization and the provision of customer satisfaction.

TONG HSING ELECTRONIC IND., LTD. TONG HSING ELECTRONIC IND., LTD. Menu About Us Introduction Management Team

The base date of the share conversion is tentatively set at 30 June 2020. TONG HSING ELECTRONIC IND., LTD. is a leading manufacturer of niche polycrystalline modules and optical components for packaging in Taiwan, and the largest manufacturer of Ceramic Metalized Substrate in Taiwan.

同欣電子的封裝服務與基板製造技術，現已廣泛應用於：無線通訊、MEMS、 影像感知器、光電半導體元件、LED、太陽能電池、汽車電子、電腦周邊零組件、醫療與網路設備等領域

Department of Electrical Engineering, National Taiwan University Institute of Business & Management, National Chiao-Tung University Chairperson of Kaimei Electronic Corp General manager of Tong Hsing Electronic Ind., Ltd Chia-Li Huang / Chief Operation Officer & Chief Financial Officer Public Finance, National Chung-Hsing University.

Active Metal Brazing Thick Film Printed Circuit Substrates TONG HSING ELECTRONIC Company's information TONG HSING ELECTRONIC IND., LTD. ADD :No.88, Lane 1125, Heping Rd., Bade Dist., Taoyuan City 334, Taiwan TEL : 886-2-26790122 FAX : 886-2-26791211

Since 2017, TONG HSING has been certified to ISO 45001 Occupational Safety and Health Management System, demonstrating TONG HSING's commitment to ensuring sound working conditions, health, well-being and equality of practice for its employees.

同欣電子的封裝服務與基板製造技術，現已廣泛應用於：無線通訊、MEMS、 影像感知器、光電半導體元件、LED、太陽能電池、汽車電子、電腦周邊零組件、醫療與網路設備等領域