Lam’s VECTOR ® PECVD products are designed to provide the performance and flexibility needed to create these enabling structures within a wide range of challenging device applications.

VECTOR Product Family Plasma-Enhanced Chemical Vapor Deposition (PECVD) Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Our PECVD product family provides precise dielectric film deposition at high productivity for a wide range of device applications.

Aug 7, 2019 · Designed to provide a cost-effective solution for controlling wafer bow in 3D NAND manufacturing, the VECTOR DT system is the newest addition to Lam’s plasma-enhanced chemical vapor deposition (PECVD) product family.

Mar 14, 2011 · The new, modular VECTOR Excel platform features innovative interface engineering to reduce RC interconnect delay, coupled with industry-leading productivity. The VECTOR Excel deposition chamber employs the proven multi-station sequential processing (MSSP) architecture of the VECTOR platform.

Jul 20, 2019 · Lam Research makes products for semiconductor manufacturing. David K. Lam founded the company in 1980 in Santa Clara, California. The company went public in 1984.

Jul 13, 2015 · Using Lam's advanced ALD capabilities, the latest VECTOR ALD Oxide system delivers the uniformity required for CD control of the ultra-thin films critical to SADP and SAQP schemes.

Jul 8, 2014 · Lam's new systems address this need for three of the most critical steps in forming 3D NAND memory cells: stack deposition (VECTOR® Q Strata™), vertical channel etching (2300® Flex™ F Series), and tungsten wordline deposition (ALTUS® Max ICEFill™).

Dec 16, 2019 · Lam Research has built 300 mm technological expertise and a comprehensive range of products that meet specific needs, including those for piezoelectric and wide band gap materials, and high-performance deep silicon etch applications.

LAM RESEARCH / NOVELLUS Vector Express' temperature-controlled roll and chuck provide uniform and precise pre-heating of the substrate to provide an even etch without pattern distortion. It has a fast wafer-climate shift of ±20°C within 5 seconds which …