Super Lube Silicone Heat Sink - 3 oz. tube. Silicone compound blended with thermally conductive, fine metal oxide powders. Will not harden or melt. Will not react to rubber or plastic. Non-toxic.

2-Pack GT-1 Silver CPU Thermal Paste (1g*2), High Performance Thermal Compound Paste, Heat Sink Compound, Ultra-Low Thermal Impedance Thermal Grease for CPU/PS4/PS5/PC/GPU Coolers

Super Lube® Heat Sink Thermally Conductive Compound is a non-curing silicone paste, blended with thermally conductive, fine metal oxide powders. It will not harden, dry out or melt, and aids in the efficient transfer of heat away from electronics and electrical components.

Thermal paste is used to improve the heat coupling between different components. A common application is to drain away waste heat generated by electrical resistance in semiconductor devices including power transistors, CPUs, GPUs, and LED COBs.

Heat sink compound, commonly known as thermal paste, is electrically non-conductive. Its primary purpose is to enhance thermal conductivity between a heat-generating component, like a CPU or GPU, and a heat sink or cooling solution.

Repair chips, cracks, and tears in various surfaces. Choose from our selection of heat sink bonding compounds, non-bonding heat transfer compounds, heat-transfer compounds, and more. In stock and ready to ship.

Invest in Super Lube Heat Sink Thermally Conductive Compound - 3 oz. Tube (98003) for reliable and effective thermal management. Superior Thermal Conductivity: Enhances heat dissipation for electronic components. Stable Performance: Maintains consistency under varying temperatures. Non-Curing Formula: Stays in place without drying out.

Thermal paste, also known as thermal compound, thermal grease, or heat sink paste, is a thermally conductive material applied between a heat source (such as a CPU or GPU) and a heat sink. Its primary purpose is to eliminate air gaps and …

Thermal paste, also known as heat sink compound or thermal interface material (TIM), is a substance used to improve the thermal conductivity and transfer of heat between two surfaces, typically the CPU (central processing unit) or GPU (graphics processing unit) and the heat sink.