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    PCB Routing Tips: Navigating Your Way Through B…

    The world of PCB assembly certainly has no shortage of acronyms. Ball Grid Arrays (BGA) enable PCB designers to easily route high-density connections to integrated circuits. The underside of the surface mount technology (SMT) chip package establishes connectivity while the upper side of the array provides an easy-to-use package for integrated circu...

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    No matter the type, every Ball Grid Adapter has characteristics that affect the minimum trace width, via styles, and required layer count. While the Ball Diameter represents the diameter of the solder ball, pitch describes the spacing between two adjacent balls. Ball diameters and pitch configurations vary with the different types of BGA designs. M...

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    BGAs may have as many as 1000 pins. The sheer number of pins requires multiple signal layers for routing the traces. One of the challenges faced by designers working with BGA fanouts involves finding exit routes that do not create fabrication or noise problems. Your fanout strategy must consider the number of signal pins, the BGA pad and via sizes,...

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