According to Infineon, these wafers—the thinnest of its type to be mass-produced—will enhance the efficiency, density, and reliability of its power converters.

In September 2024, India and Singapore signed an MoU to partner and cooperate in semiconductors. Within a few weeks, India’s ...

wafer slicing, etching and polishing, bonding, cleaning, epitaxial deposition and metrology. The final regulations are also broader from the Commerce Department final rule as it relates to ...

A few of these are noted below: SEMI Specification PV17-1012 Category 1 will determine whether the silicon ... wafer through formation of an ingot from polysilicon and subsequent slicing.

A difficult-to-describe nanoscale object called the magnetic skyrmion might one day yield new microelectronic devices that ...

In the real world of electronics and silicon wafers—no matter how thin—skyrmions have to ... If you are looking at a skyrmion magnetic whirlpool from the top and start slicing off layers, you might ...

However, in the real world of electronics and silicon wafers — no matter how thin — skyrmions have ... If you are looking at a skyrmion magnetic whirlpool from the top and start slicing off layers, ...