The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic ...

Improvements are still needed in integration of data and tools, but faster multi-physics simulations are becoming essential ...

A new technical paper titled “Scalable MatMul-free Language Modeling” was published by UC Santa Cruz, Soochow University, UC ...

In an invited presentation at CS Mantech 2024, Charlie Parker, senior machine learning engineer at Tignis, provides context for the AI hype cycle with a high-level overview of machine learning ...

Successful innovation does not happen in a vacuum. Someone must make a considerable gain for it to gain traction. Otherwise, ...

Rethinking traditional workflows by shifting left can help solve persistent problems caused by process and thermal variations ...

TCAD models are the fundamental building blocks for the semiconductor industry. Whether it is a new process node or a new multi-billion dollar fab, accurate TCAD models must be developed and ...

Improving the quality and performance of EV battery designs, without compromising range performance, power density, and ...

An LLM-driven Approach for Large-Scale System-on-Chip Security Verification and Policy Generation” was published by ...

Functional verification ensures that a design meets its specification requirements. The initial 80% of the verification ...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress ...

The landscape of electronic design automation (EDA) is undergoing a monumental transformation. The catalysts? Artificial ...