The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...
To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...
Intel has introduced a new Value Pack format for its processors with the aim of lowering costs. This new option is not ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond-silicon materials, chip interconnects, and packaging technology ...
He ended with a sentiment that applies to everyone we've met from Intel while researching this article: "I truly believe this is the most fun time and the exciting time to be in packaging.
While the new strategy consists of three key initiatives, there are many moving parts in what Gelsinger called a “major evolution ... said. Intel will use its Foveros 3D packaging technology ...
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Intel Arrow Lake non-K 65W CPU box packaging leaked — Bulky design alludes to included stock cooler, likely arriving next month at CESHardware data aggregator, momomo_us on X, has shared the box packaging of Intel's Arrow Lake non-K processors, expected to launch next month. The bulky design suggests the inclusion of a stock ...
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