The thinness of silicon wafers is important because it reduces resistance and power loss. Current-gen wafers measure 40 to 60 ...

Infineon has unveiled the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometers, in a high ...

Fig. 3: Simplified collective die-to-wafer bonding flow with pictures of the N=2 target wafer (after tier 1), the N=3 bonded stack and the N=3 target wafer (after tier 2). (Credit: imec) Multi-tier ...

Researchers at the Korea Institute of Machinery and Materials have developed a way to grow 2d transition metal ...

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest ...

Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the ...

Infineon Technologies AG announced it has unveiled an advance in handling and processing "the thinnest silicon power wafers ever manufactured," with a thickness of 20 micrometers and a diameter of 300 ...

TrendForce reveals that HBM5 20hi stack products will adopt hybrid bonding technology by 2025, which could transform DRAM industry's business models ...

Infineon unveils 'world's thinnest' silicon power wafer Infineon Technologies has unveiled what it describes as“the next ...

Chip-on-Wafer, stacked wafers, MEMS, and over-molded wafers. "The SpinSAM AMI system represents a significant advancement in wafer inspection technology, offering customers unmatched speed and ...