TweakTown1d
NVIDIA shows off future of 'AI compute' with silicon photonics, 3D GPU + DRAM stacking
NVIDIA's vision of the future of AI compute: silicon photonics interposer, GPU 'tiers' possible GPU on GPU, 3D stacked DRAM ...
Yonhap News English on MSN10d
SK hynix leads HBM market with early investment in stacking tech: company official
SK hynix Inc.'s early commitment to advanced chip stacking technology has been a key driver of the South Korean chipmaker's ...
What is high bandwidth memory and why is the US trying to block China’s access to it?
The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI ...
Design-Reuse7y
Design Considerations for High Bandwidth Memory Controller
High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...
Nvidia's eyeing up ways to beef up its future AI chips with GPUs on top of GPUs and the power of light
Nvidia's latest prediction, as outlined at the IEDM 2024 conference according to Dr. Ian Cutress (via TechPowerUp ), is AI ...
Hosted on MSN1mon
SK hynix announces the world's first 48GB 16-Hi HBM3E memory — Next-gen PCIe 6.0 SSDs and UFS 5.0 storage are also in the works
HBM4 will double the channel width from 1024 bits to 2048 bits while supporting upwards of 16 vertically stacked DRAM dies (16-Hi) - each packing up to 4GB of memory. Those are some monumental ...
Design-Reuse3d
Inapac Technology Unveils Breakthrough Solution for Integrating DRAM in System-in-Package, Multichip Applications
"To meet and exceed the demand for enhanced multimedia functionality such as imaging, video, and 3D gaming in next generation mobile handsets, we opted to integrate our SoC media processor into a SiP ...