Wafer and substrate processing steps can include thin polishing or chemical mechanical planarization, film deposition (PVD, CVD or electrodeposition), polishing, etching, patterning or lithography, ...

In this study, researchers proposed a testing process using a cryogenic 300-mm wafer ... at the chuck and 1.6 ± 0.2 K electron temperature. Thousands of test structures and spin qubit arrays ...