By utilizing a chiplet approach, you can integrate various components onto a single platform, allowing for a plug-and-play ...

Research institute develops silicon photonic interposer with minimal latency, looks to commercialize the idea.

Record-Breaking Chiplet Interconnect: Eliyan's NuLink™-2.0PHY, manufactured in a 3nm process, delivers 64Gbps per bump, the highest performance for die-to-die PHY solutions, doubling bandwidth.

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal ...

CEA-Leti, a European technology research institute is working on optical interposers, could fuel new innovation in the ...

The “Universal Chiplet Interconnect Express” or “UCIe” could reshape new semiconductor designs, intended to enable chipmakers to mix and match silicon from different vendors inside a ...

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology ...

Cadence is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node ...

Baya Systems, a leader in system IP technology for intelligent single-die and multi-die compute systems, is pleased to announce its strategic partnership with IPro Silicon IP Ltd. This collaboration ...

Alphawave Semi has made available the industry’s first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) ...

ECAD-MCAD collaboration; AXI4 locking mechanism; SRAM PUF; ADAS challenges; gate resistance; Gemini AI’s network comms.