Cerebras Now The Fastest LLM Inference Processor; Its Not Even Close
The company tackled inferencing the Llama-3.1 405B foundation model and just crushed it. And for the crowds at SC24 this week ...
Ubitium tackles edge AI and more with new universal processor
With this chip, Ubitium hopes it will be able to replace dedicated processors for specialized computing tasks at the edge, like NPUs for AI.
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Infineon advances 300 mm GaN power wafer technology
Infineon Technologies AG has progressed in its development of what it claims is the first 300 mm gallium nitride (GaN) power ...
Wafer Processing Equipment Market: Analyzing Growth Opportunities And Strategic Insights
( MENAFN - EIN Presswire) Wafer Processing Equipment market Expected to Reach $14.4 Billion by 2031-Allied Market Research ...
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Infineon Unveils Thin Silicon Wafer for AI Data Centers
Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...
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Fully automated system for simultaneous grinding of silicon and copper
3) Si wet and dry etching: Si wet etching is the processing wafers by selectively dissolving them using chemicals (etchant). Si dry etching is the processing wafers using high-vacuum plasma.