With this chip, Ubitium hopes it will be able to replace dedicated processors for specialized computing tasks at the edge, like NPUs for AI.
Llama 3.1 405B runs at nearly a thousand tokens a second on Cerebras Inference, and took a quarter of a second to get the ...
Infineon Technologies AG has progressed in its development of what it claims is the first 300 mm gallium nitride (GaN) power ...
( MENAFN - EIN Presswire) Wafer Processing Equipment market Expected to Reach $14.4 Billion by 2031-Allied Market Research ...
At the GlobalFoundries Technology Summit 2024, the theme was “AI Everywhere” as AI has impacted everything from IoT to the ...
Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...
3) Si wet and dry etching: Si wet etching is the processing wafers by selectively dissolving them using chemicals (etchant). Si dry etching is the processing wafers using high-vacuum plasma.
Cerebras, which designs wafer-scale AI processors that it claims outperform Nvidia's GPUs for AI training, is now preparing ...