Investors are banking on growing orders for Besi's hybrid bonding solutions, a critical chip technology allowing two chips to be bonded directly on top of each other, and its first-mover advantage ...

According to Nikkei Asia, wire bonding machines, wafer dicers, and laser drilling machines are all in short supply, with orders for new machines booked out for a year. Like toilet paper this time ...

Revenue came in below FactSet consensus of EUR 160 million, but investors liked the results due to progress in hybrid bonding adoption. Shares are up 10%. Why it matters: BE Semiconductor reported ...

The two companies began working together in 2020 and recently extended their agreement to co-develop the industry's first fully integrated equipment solution for die-based hybrid bonding.

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor ...

Comment from Dr Gilles Martin, Eurofins CEO: “The successful issuance of our new €400m hybrid bond reinforces Eurofins’ strong balance sheet and confirms investor confidence in Eurofins ...