Fan‐out wafer‐level package (FO‐WLP) has become a key‐enabling technology for multichip and 3D system integration. As one type of FO‐WLP, embedded silicon fan‐out (eSiFO) technology, in which silicon ...

Abstract: Nepes Corporation's fan‐out wafer‐level packaging (FO‐WLP) technology was first introduced in the year 2010 on a 300 mm platform. Nepes' FO‐WLP system‐in‐package solution offers 40‐90% ...

SK Hynix has unveiled a groundbreaking fan-out memory packaging technology that merges wide I/O capabilities with cost-effectiveness. This innovation is set to redefine memory solutions in the tech ...

In response to the large-scale production and high cost-effectiveness packaging need for automotive and AI high-speed computing chips, ITRI has developed fan-out panel level packaging that features ...