Samsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory ...

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the ...

Hybrid bonding is a method of stacking chips through copper without the use of 'bumps' connecting the DRAM mounted on HBM. This enables a reduction in chip size while improving performance metrics ...

Investors are banking on growing orders for Besi's hybrid bonding solutions, a critical chip technology allowing two chips to be bonded directly on top of each other, and its first-mover advantage ...

The two companies began working together in 2020 and recently extended their agreement to co-develop the industry's first fully integrated equipment solution for die-based hybrid bonding.

While working at Huawei, the suspect allegedly took IP related to CMOS image sensors (CIS) and hybrid bonding chip packaging technology that is used for 3D NAND, HBM3/HBM3E/HBM4 memory ...

Revenue came in below FactSet consensus of EUR 160 million, but investors liked the results due to progress in hybrid bonding adoption. Shares are up 10%. Why it matters: BE Semiconductor reported ...