He says that with vertical channel transistors (VCTs), or 3D DRAM, 'the process can be designed ... SK hynix is gearing up to wed VCT and 4F^2 (4F2) cell design to make ultra-dense DRAMs (arguably ...

6F2 DRAM, and 3D NAND devices and is extendible to 4F2 DRAM, complementary field-effect transistors, and 3D DRAM. These devices require etch steps and Extreme Ultraviolet (EUV) lithography ...

Leuven, Belgium – Ocotober 1, 2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as ...

Akara enables the scaling of gate-all-around (GAA) transistors, 6F2 DRAM, and 3D NAND devices and is extendible to 4F2 DRAM, complementary field-effect transistors, and 3D DRAM. These devices ...