Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...

“Form factor is one big consideration,” says Sooyong Kim, senior product manager in 3D-IC Chip Package Systems and Multiphysics at ANSYS. “They want to make things smaller. Mobile was one of the ...

The earliest ICs followed the same packaging format as the transistor (a TO-5 metal package) differing only in the number of leads (Figure 3-1). Figure 3-1: Transistor and an Early IC Package (TO-5 ...

To meet the surging demand for multi-die designs, Faraday has announced a new 2.5D/3D-IC advanced package service. These advanced packaging technologies are critical for industries such as ...

Lightmatter, the leader in photonic supercomputing, today announced a strategic partnership with Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, ...

Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei. Save my User ID and ...

will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve this milestone in collaboration with our 3D integration partners including ...

Hsinchu, Taiwan -- Sep. 12, 2023-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...