SK hynix, which notably supplies memory chips to NVIDIA (among other customers), said it has begun volume production of the world's first 12-layer high bandwidth memory 3E (HBM3E) chips in a 36GB ...

Micron's roadmap shows 12-layer HBM3e will be the de facto choice for AI until 2026 when HBM4 arrives. Credit: Micron Micron says despite increasing capacity for its HBM3e offering by 50% due to ...

Instead, he used SprintLayout 6.0 which allows you to import pictures and use them as a guide for recreating a PCB layout ... it to a component on a user layer. Then you can add the new component ...

K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip vendor.

What’s the better option: a single-phase controller design or two converters interleaved in a dual-phase design? This article ...

Doped regions and N-P junctions are the electronic hearts of the active components in a circuit. However it takes various other layers of semiconductors, dielectrics, and conductors to complete the ...

As he draws the traces on their own layer, switching back and forth between images of the board immediately begins to demystify the connections split between the two layers. He certainly makes it ...

So the Hansons added an extra layer of padding to the XTs to create a beefier version, the 12-ounce Guardian NXT (with the N standing for NFL). It fared much better. For a 2021 article published ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) ...

SK hynix has begun mass production of the world's first 12-layer HBM3E product with 36GB, the largest capacity of existing HBM to date. According to the company, it plans to supply mass-produced ...